Abrasive Powder of Semiconductor Monocrystal Silicon Wafers (PWA)

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CA (Flat Calcined Aluminum Oxide Lapping Powder) applies special production technology, which enables CA to have a equal particle size. CA’s crystal shape is platelet, different from equivalent shape or ball shop of traditional abrasives. With this platelet shape CA particles move parallel to the workpiece surface during the grinding or polishing course, thus gliding lapping effect was created, different from rolling lapping effect of traditional abrasives. So the particles will not scratch the workpiece surface. At the same time, because the lapping press distributes equally on the surface of the platelet particles, the number of crashed particles will be less, particles’ endurance of lapping will be increased greatly, and so can provide best grinding & polishing effect and surface glaze. Experiments prove that CA abrasives will lessen down grinding and lapping times at least 10-20%, and can achieve fast grinding and polishing. When customers use CA, the amount just need to be 50% or more as much as traditional abrasives.

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JiuDe Technology Co., Ltd

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