2 Inch Sapphire Wafer

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2 Inch Sapphire Wafer
Posting date : Apr 27, 2011
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HS-CODE
90-
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Detailed Description
Description : 2" Epi-ready Sapphire Polished Wafer 1. Material : >99.99% Single Crystal Al2O3; 2. Orientation : C-axis[0001] tiled M-axis 0.2±0.1°, Degree 3. Primary Flat : A-Axis [11-20] ± 0.2°, Degree 4. Diameter : 50.80 ± 0.15 mm 5. Thickness : 430 ± 15 μm 6. Flat Length : 16 mm ± 0.5 mm 7. TTV : ≦ 10 um 8. Bow : -10 ~ 0 um 9. Warp : ≦15um 10. LTV: ≦10um 11. TIR : ≦10um 12. Frontside Surface Roughness : ≦10 Å 13. Backside Surface Roughness : 0.8 ≦Ra ≦1.2um 14. WaferEdge: R-Type 15. Laser Mark : Front side skype:flame1688

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