Quick Detail
Place of Origin
HS-CODE
S04-
Package & Delivery Lead Time
Detailed Description
- Base material: FR4, Aluminum, Ceramic, Rogers, F4BK, F4BT, TP, PF, CEM-1, CEM-3, high Tg etc
- Board thickness: 0.30 to 3.20mm (12 to 126mil)
- Copper thickness: 0.50 to 5 ounce
- Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
- Minimum line width: 0.075mm (3mil)
- Minimum line space: 0.075mm (3mil)
- Minimum hole diameter: 0.10mm (4mil)
- PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
- NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
- Maximum board size: 460 x 620mm (18 x 24)
- Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers
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