Sputtering target: (GPT9 GPT9-1)

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1)Metal sputtering targets List: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), Dysprosium (Dy), Erbium (Er), Europium (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum (Mo), Magnesium (Mg),Neodymium (Nd), Niobiums (Nb), Nickel (Ni), Palladium (Pd),Platinum (Pt), Praseodymium (Pr),Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc),Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn)2) 2)Alloy sputtering target: AlCu, AlCr, AlMg, AlSi, AlSiCu, AlAg, AlV, CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm, CrSi, CoCr,CoCrMo, CoFe, CoFeB ,CoNi, CoNiCr, CoPt, CoNbZr, CoTaZr, CoZr, CrV, CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt, CuZr,DyFe, DyFeCo, FeB,FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe, InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn, NiNbTi, NiTi, NiV, SmCo, AgCu, AgSn, TaAl, TbDyFe, TbFe, TbFeCo, TbGdFeCo, TiAl, TiNi, TiCr, WRe, WTi, WCu, ZrAl, ZrCu, ZrFe, ZrNb, ZrNi, ZrTi, ZrY, ZnAl, ZnMg 3)Ceramic Sputtering Target Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB, VB2, ZrB2 Carbide Ceramic Sputtering Targets : B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC, TiC, WC, W2C, VC, ZrC Fluoride Ceramic Sputtering Targets : AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3 Nitrides Ceramic Sputtering Targets :AlN, BN,GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN Oxide Ceramic Sputtering targets: Al2O3, Sb2O3, ATO ,BaTiO3, Bi2O3, CeO2, CuO, Cr2O3 ,Dy2O3 ,Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu3Fe5O12, Lu2O3, MgO, MoO3, Nd2O3, Pr6O11, Pr(TiO2)2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG, Y3Al5O12, Yb2O3, Y2O3, ZnO, ZnO:Al, ZrO2(unstabilized), ZrO2-5-15wt%CaO) Selenides Ceramic Sputtering Targets: Bi2Se3, CdSe, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe Silicides Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2 Sulfides Ceramic Sputtering Targets: Sb2S3, As2S3, CdS, FeS, PbS, MoS2, NbS1.75, TaS2, WS2, ZnS Tellurides Ceramic Sputtering Targets:CdTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe Other: Cr-SiO, GaAs, Ga-P, In-Sb, InAs, InP, InSn, LSMO, YBCO, LCMO Substrate wafer: Al2O3, , BaF2, CaF2, GaAs, GaP, Ge, InP, LiNbO3, LiTaO3, MgO, MgF2, Si, SiO2 Oxygen ,oxide material

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Group International Industrial Limited

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