sealing face,rings(silcon carbide)

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sealing face,rings(silcon carbide)
Posting date : Aug 11, 2010
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81-
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SSIC Technical Data( Sefl-sintered silicon carbide): SIC Purity (%) ≥ 98 Granuliform (um) 0.5 - 0.7 Density (g/cm3)≥ 3.10 Hardness (HRA) ≥ 93 Bending strength (Mpa) 400-500 Compressive strength (Mpa) >2500 Fracture Toughness 3.50-4.60 Modulus of elasticity (GPa) 380-410 Thermal conductivity (Cal/cm. S. 0c) 0.2 Coefficient of thermal expansion (mm/mm0k) 5.20- 4.2 Poisson ratio 0.14 RSIC Technical Data(Reaction Bonded silicon carbide): SIC Purity (%) ≥ 90 Granuliform (um)8-20 Density (g/cm3)≥ 3.05 Hardness (HRA)>90 Bending strength (Mpa)350-450 Compressive strength (Mpa)> 2500 Modulus of elasticity (GPa)>350 Thermal conductivity (Cal/cm. S. 0c)0.3 Coefficient of thermal expansion (mm/mm0k)4.5 Poisson ratio0.15 SIC+C Technical Data: SIC Purity (%): SiC Content 60%/; C Content 30%; Si Content 10% Density (g/cm3)>2.85 Hardness (HRA)>80 Bending strength (Mpa)250~300 Compressive strength (Mpa)>1500 Modulus of elasticity (GPa)250 Coefficient of thermal expansion (mm/mm0k)3.0

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