Quick Detail
Place of Origin
HS-CODE
S12-
Package & Delivery Lead Time
Detailed Description
Material:FR-4
Layer Coverage:4Layers
Thickness:0.8mm
Surface Technique:Chem.Ni/Au
Line Width/Space:3mil/3mil
Solder Mask Color:Green
Special:BGA.Impedance, HDI
Rigid PCB Capabilities
Layers:1-30 Layers
HDI PCB:1+n+1, 2+n+2, 3+n+3
Thickness:0.2 - 12.7 mm
Track - Gap:Min.0.075 mm
Min.Holesize:0.05 mm micro via for Laser driller, Min.0.15mm via for NC driller
Max.PCB size:23inch*35inch(584.2mm*889mm)
Impedance Tol.:4 - 30 Layers up to 50Ω+/- 5 Ω;Over 50 Ω+/- 5%
Aspect ratio:20:1
Material:FR1, FR2, HB for single-sided, FR4 with High-Tg or Halogen Free, CEM3, Rogers, Aluminium based, Leadfree compatible, Taconic, Hi Frequency.
Surface treatment:Chem.Ni/Au, immersion Sn, /Silver, HASL Leadfree, OSP, Flash Gold, HASL&HASL Leadfree+gold finger, conductive carbon ink.
Copper weight:0.5 Oz, 1 Oz, 2 Oz, 3 Oz, up to 5Oz
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