Gold-plated PCB with Wet Film Solder Mask

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Gold-plated PCB with Wet Film Solder Mask
Posting date : Jun 10, 2010
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HS-CODE
S04-
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Detailed Description
Production capacity: Maximum board size-standard: 508 x 610mm, on request: 610 x 610mm Minimum/maximum board thickness-standard: 0.6mm/3.0mm, on request: 0.4mm/3.2mm Minimum finish hole size-standard: 0.50mm, on request: 0.30mm Maximum aspect ratio-standard: (4:1), on request: (8:1) Minimum line width-standard: 0.10mm, on request: 0.13mm Minimum line pitch-standard: 0.10mm, on request: 0.13mm Minimum SMT device pitch-standard: 0.45mm, on request: 0.30mm Minimum SMT device land width-standard: 0.254mm, on request: 0.254mm Board flatness tolerance-standard: 0.5-percent board diagonal, on request: 0.5 to 1-percent

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