Copper foam

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Copper foam
Posting date : May 11, 2010
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HS-CODE
74-
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Detailed Description
Porosity: 5—120 PPI (pores per inch) Density: 0.15~0.45g/cm3 Cavity: 90%—98% Element: Cu+Ni, Cu+Al, Cu+Zn Dimension: 600×500×1—100mm ¨ Feature 1. Excellent mechanical property and processability; 2. Extraordinary electricity and heat conductivity; 3. Massive intricate, lattice-like inner structure 4. the excellent ability of corrosion resistance, superior tensile strength, favorable ductility; 5. Magnificent electromagnetic shielding ability. ¨ Application 1. Heat elimination material for electronic components, such as CPU, Display Card and LED; 2. Heat transmission for various wafer modules; 3. Heat exchange for the solar-powered heater and heat-accumulated system. 4. Filtration materials of air/oil/smoke/cooking etc; 5. Filter element of industrial and civil filters.

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