Addition cure encapsulant and potting compound HY-220

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Addition cure encapsulant and potting compound HY-220
Posting date : Jan 22, 2010
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Free Member Scince Jan 22, 2010
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CHEMICAL | Organic ch
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HS-CODE
29-
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Detailed Description
Usage: Filling for LED,LCD electronic display, circuit board. Description: Applications: It is applicable to sealing,bonding,coating for electronic parts.　 HY-220 is two-component addition cure silicone rubber which can be divided into a transparent type and a flame resistant type. The product, which can be vulcanized under room temperature or moderate temperature with low viscosity, easy mixing and pouring, is applicable to bulk pouring with excellent electrical performance.
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