Multi-gold PCB board

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Multilayer pcb with imm gold finishi,FR4,1.6mm,35um Cu. Production line: 1~30 layers,FR4,CEM1,2,3,4,AL based,Isola,TEFLON Your PCBs can also maybe manufactured as followed: 1) Surface finishi:HAL LF ,Immersion Gold, Immersion Tin, Immersion Silver, Plating Gold,OSP,optional. 2) Solder mask Green,red blue,white, black. 3) Standared:UL,SGS,ROHS. Our production capability for Rigid PCB: 1)Layer:1-30 2)Board finishied thickness:0.20-6.0mm 3)Material:FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on. Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui 4)Maxpanel size:32”±20”(800mm±508mm) 5)Min width/space(min):4mil/4mil 6)Max copper weight:140um(4oz) for inner layer 175um(5oz) for outer layer 7)Min machine drill size:0.2mm(8mil) 8)Via hole tpye:Blind/Burried/plugged 9)Thickness of finished board:0.20-6.0mm 10)Tolerance:Registration of innerlayer to of innerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.4-2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: +/-0.1mm Thickness>0.1mm:+/-10% Outline router: +/-0.1mm Outline Score: +/-0.2mm 11)Color of solder mask:Green, Black, Blue,Red, White and so on 12)Surface freatment:HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating (gold thicness up to 120u”),Gold figers ,Carbon print, Peelabe Mask 13)Hardness of solder solder:>=6H 14)Outline finished:CNC, V-CUT, Punching 15)Peel strength of line:≥61B/in 16)Warp and twist:≤0.7%

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Akeson Circuit Co.,Ltd

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