Quick Detail
Place of Origin
HS-CODE
29-
Package & Delivery Lead Time
Detailed Description
Name High temperature resistant electronic components encapsulating adhesive（THO4054）
Outline This double-component product is epoxy adhesive. It is easy and convenient to use for it solidifies fast at normal temperature and bonds well. No bubbles appear after curing thus making the surface smooth and bright. The series has two categories, room temperature curing and heat curing. Its liquidity, color and heat-resistance quality are adjustable.
Applications It applies to the encapsulating electronic components and chips in transformers, rectifiers, AC capacitor, ignition coils, electronic modules, negative ion generator, atomizer, and other products to protect them against moisture, chemicals, excessive heat, vibration, mechanical impact and thermal shocks.
Features Component A is pasty, non-solid particle. component B is in tinted paste shape.
Fast curing velocity. At 77 °F, within 1-3 hours, it is at the early stage of curing, 12 hours later, it reaches its maximum bonding strength.
Being durable and resistant to ultraviolet light once the bond has formed.
Being heat-resistant, it adapts to a wide range of temperature and bonds well under high temperature.
Mix the two components in a certain proportion, apply it to the surface of the substrates directly, which makes it so convenient to use.
You'll get long term durability and resistance to moisture, chemicals, oils, and temperature extremes.
Non-toxic after solidification, though it is a little smelly.
Being stable, its storage time is one and a half year.
The main technical parameters are as follows:
Heat resistance scope：-104 °F—+716 °F
volume resistance: 1×10×15Ω.cm sheet resistance 2.5×1015Ω
voltage withstand 20-24kV/mm hardness shore D 90
Water absorbing capacity 24h＜0.1% Tg:300-400℃
Cementation intensity: Tensile strength≥25MPa; Shearing strength≥20 MPa
Instruction 1. Clean the surface of the material, make sure they have no dust or oil on them, wait until they are dry.
2. Mix A and B in a proportion of 10: 1.2--1.5 to get perfect bonding result at fastest speed at 77 °F.
3. Spread the mixture on the substrates, put them together and apply some strength on them, finally, let them dry for 2-4 hours.
Notes 1.The tools used to get adhesives should have exclusive usage.
2. It is necessary to keep it well ventilated and away from fire.
3. If it has contact with skin, you should wash with soap.
4. It can be stored at well-ventilated places with low temperature, and keep them away from fire. Cover the lip after using it.
Copyright © 2005-2009 Thomas Technology, Inc. All Rights Reserved.
Click enlarge Image
