Quick Detail
Place of Origin
HS-CODE
29-
Package & Delivery Lead Time
Detailed Description
Product name Electromagnetic shielding high temperature resistant adhesives(THO4067)
Outline It is modified epoxy adhesive. It is easy and convenient to use for it solidifies fast at normal temperature and bonds well., No bubbles appear after curing thus making the surface smooth and bright. The series has two categories, room temperature curing and heat curing. Its liquidity, color and heat-resistance quality are adjustable.
Applications It applies to the self-bonding and mutual-bonding of metal, ceramics and composite materials in high temperature conditions in the fields of aviation, aerospace equipment telecommunication equipment and microwave products. And it also applies to the bonding, filling, sealing and repairing of heated parts of microwave products chips.
Features The A component is pasty, non-solid particle. The B component is in tinted paste shape.
Being durable and resistant to ultraviolet light, once the bond has formed.
Being heat-resistant, it adapts to a wide range of temperature and bonds well under high temperature.
Mix the two components in a certain proportion, apply it to the surface of the substrates acquiring no strict treatment, which makes it so convenient to use.
You'll get long term durability and resistance to moisture, chemicals, oils, and temperature extremes.
Non-toxic after solidification, though it is a little smelly.
Being stable, its storage time is one year.
The main technical parameters are as follows:
Microwave penetration resistance <50MHZ; >2450MHZ
volume resistance: 1×1015Ω.cm sheet resistance 2.5×1015Ω
voltage withstand 20-24kV/mm hardness shore D 90
Water absorbing capacity 24h<0.1% vitrification point 90-100℃
Cementation intensity: Normal temperature: Tensile strength≥35MPa;(steel) Shearing strength≥25 MPa(steel)
At 302 °F: Tensile strength 4-5.5 MPa
Instruction 1. Clean the surface of the material, make sure they have no dust or oil on them, wait until they are dry.
2. Mix A and B in a proportion of 10: 2—2.4 to get perfect bonding result at fastest speed at 77 °F
3. Spread the mixture on the substrates, put them together and apply some strength on them, heat it.
4. To reinforce the adequacy of mixing A and B, B can be heated in hot water if the temperature is too low in winter.
Notes 1 It is necessary to keep it well ventilated and away from fire .
2.If it has contact with skin, you should wash with soap.
3 It can be stored at well-ventilated places with low temperature, and keep them away from fire. Cover the lip after using it.
Copyright © 2005-2009 Thomas Technology, Inc. All Rights Reserved.