PCB Assembly 03

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PCB Assembly 03
Posting date : Jan 20, 2009
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HS-CODE
S04-
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Detailed Description
Manufacture or design according to customer requirement Providing single,double sided, and multi-layered PCBS up to 12 layers SMT technology capability Through holes capability Quick prototype fast turnaround COB wire bonding technology Ultrasonic welding packaging Blister pack according to customer"s requirement RoHs capability BGA assembly, components on consigment Worldwide component procurement

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