multi-layer FPC

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multi-layer FPC
Posting date : Dec 17, 2008
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Free Member Scince Dec 17, 2008
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S12-
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Company Qualification On April 2003, the Company became a member company of Shenzhen Enterprise Technology Innovation and Promotion Council On October, 2003, passed ISO9001:2000 Quality Management System Authentication. On November, 2004, became a member company of Shenzhen High Technology Institute. On December, 2004, passed US UL Safety Authentication(File No:E250639) On January, 2007, passed ISO14001:2004Environment Management System Authentication. CIPC member company On July,2007,became a high-and new-technology enterprise, with No.:S20077179 Professional Teams We have 35 researchers at the present, and 25 of them are college degree or above. Research and development trends: 1 Remote pitch product (Pitch:0.09mm) 2 Narrow aperture product (hole 0.1mm) 3 Impedance Circuit 4 Rigid-Flex Circuit Quality objective of THREE GOLDS PRECISE CIRCUIT qualification rate of single sided >98% qualification rate of double sided >95% qualification rate of multistage sided >90% qualification rate of initial workpieces >90% qualification rate of inspectation >95% qualification rate of finished products >99% FPC Parameter Max size: 500mm X 500mm Surface finish: Sn/ Pb Plating, Chemical Immersion Sn, Gold Planting, Chemical Immersion Gold; Technological Capacity: Min line: 2mil Min space: 2mil Min hole: 0.1mm Dimension Tolerance: General Dimension: /-0.1mm Special Dimension: /-0.05mm POLYIMIDE(PI) Solder Heat Resistance: >288/10 Peeling Strength: >1.2kgf/cm Surface Resistance: >1.0 X 1011Ω Volume Resistance: >1.0 X 1015Ω Insulation Resistance: >1.0 X 1011Ω Polyimide: 0.0125 , 0.015 , 0.025 , 0.050mm Copper (RA&ED): 0.012 , 0.018 , 0.035 , 0.070 , 0.100mm POLYESTER(PET) Solder Heat Resistance: >210/10 Peeling Strength: >1.2kgf/cm Surface Resistance: >1.0 X 1011Ω Volume Resistance: >1.0 X 1015Ω Insulation Resistance: >1.0 X 1011Ω PET: 0.0125 , 0.015 , 0.025 , 0.050mm Copper (ED): 0.012 , 0.018 , 0.035 , 0.070 , 0.100mm

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
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