Addition cure Silicone Encapsulation & Potting Compounds

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Addition cure Silicone Encapsulation & Potting Compounds
Posting date : Jul 16, 2009
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40-
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Usage: filling of led, LCD electronic display,circuit board. Suitable for both thin and deep section cure. Potting sensitive components to protect from vibration, high humidity or other harsh environmental conditions. Fast efficient heat transfer from electronic components to heat sinks or outer casings. Protective coatings for pcb's. Protection for automotive electronics, control boxes, etc. Potting and sealing of cable joint assemblies. for any details information please contact nancy underline x at 21cn dot com, skype:nancyxie2007,Tel:0086-755-27052112 Fax:0086-755-27052562

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