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PCB
Posting date : May 12, 2008
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40-
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Detailed Description
contains many influential factors on the overall solder joint reliability including: pad metallurgy, board thickness, pad size, base material, via formation technology, routing method (via in pad versus fan out), PCB layer count, soldermask technology, and pad definition versus mask definition. With a variety of advanced equipment and experienced and professional staff, we have the ability to develop and process all kinds of products catering to customer's demands.

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
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