Printed Circuit Board for Mobile Phone LCD

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Printed Circuit Board for Mobile Phone LCD
Posting date : Apr 15, 2008
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HS-CODE
85-
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Detailed Description
Layer Counts: 6 Material: FR-4 Maximum Size: 450 X660mm Board Outline Tolerance: +/-0.13mm Board Thickness: 0.20mm---6.00mm Thickness Tolerance(t!Y0.80mm): +/-8% Thickness Tolerance(t<0.80mm): +/-10% Insulation Layer Thickness: 0.075mm---6.00mm Minimum Line: 0.075mm Minimum Space: 0.075mm Out Layer Copper Thickness: 12um---175um Inner Layer Copper Thickness: 12um---175um Drilling Hole (Mechanical): 0.20mm---6.35mm Finish Hole (Mechanical): 0.15mm---6.30mm Diameter Tolerance (Mechanical): +/-0.08mm(PTH); +/-0.05mm(NPTH) Registration (Mechanical): +/-0.075mm Laser Hole: 0.10mm Aspect Ratio: 10:1 Solder Mask Type: LPI SMT Mini. Solder Mask Width: 0.08mm Mini. Solder Mask Clearance: 0.05mm Plug Hole Diameter: 0.25mm---0.80mm Impedance Control Tolerance: +/-10% Wrap/Twist: 0.75% Surface Finish: HASL, Immersion Gold, Rohs Special Technologr: Blind Via

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