Multilayer HDI PCB Manufacturer
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China [CN] |
Layer Count/Technology
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4-20 layers
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4-20layers
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PCB Thickness Range
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0.5-2.4MM
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0.4-2.4MM
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Build Up Technology
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1-N-1 / 2-N-2 / 3-N-3 / 4-N-4
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1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 / 5-N-5 / 6-N-6 / 7-N-7
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Min.Laser Drill Diameter
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110μm
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75μm
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Laser Techlology
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CO2 Direct Drilling（UV/CO2)
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CO2 Direct Drilling（UV/CO2)
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Materials
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FR4/FR4 Halogen Reduced
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FR4 / Taconic / Rogers / Others on request
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Class Transition Temperature
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140℃ / 150℃ / 170℃
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140℃ / 150℃ / 170℃ / 200℃
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Standard Glass Cloth
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1027/106 / 1080/2116 / 1501/7628
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1037/106 / 1080/2116 / 1501/7628 / 1027/
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Copper Thickness
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12μm/18μm/35μm/70μm
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9μm/12μm/18μm/35μm/70μm/105μm
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Copper Plating Holes
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20μm（25μm）
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13μm / 20μm / 25μm
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Min. Line/ Spacing
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60μm / 60μm
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40μm / 40μm
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Soldermask Registration
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70μm
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60μm
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Min. Soldermask Dam
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+/-38μmPhoto-imageable）
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+/- 25μm（Photo-imageable）
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Soldermask Color
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Green / White / Black / Red / Blue
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Green /White / Black / Red / Blue
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Max. PCB Size
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575mm × 500mm
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575mm × 500mm
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Production Panel
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609.6mm × 530mm
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609.6mm × 530mm
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Min. Annular Ring
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125μm
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100μm
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Smallest Drill
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0.28mm
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0.15mm
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Smallest Routing Bit
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0.8mm
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0.8mm
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Surfaces
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OSP/Immersion Tin
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OSP/Immersion Tin
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Immersion NI/AU
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Immersion NI/AU
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Plated Ni/AU
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Plated Ni/AU
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immersion AG
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immersion AG
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Scoring
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Yes
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Yes
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ID Print
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White
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White
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