Layer Count/Technology
|
4-20 layers
|
4-20layers
|
PCB Thickness Range
|
0.5-2.4MM
|
0.4-2.4MM
|
Build Up Technology
|
1-N-1 / 2-N-2 / 3-N-3 / 4-N-4
|
1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 / 5-N-5 / 6-N-6 / 7-N-7
|
Min.Laser Drill Diameter
|
110μm
|
75μm
|
Laser Techlology
|
CO2 Direct Drilling(UV/CO2)
|
CO2 Direct Drilling(UV/CO2)
|
Materials
|
FR4/FR4 Halogen Reduced
|
FR4 / Taconic / Rogers / Others on request
|
Class Transition Temperature
|
140℃ / 150℃ / 170℃
|
140℃ / 150℃ / 170℃ / 200℃
|
Standard Glass Cloth
|
1027/106 / 1080/2116 / 1501/7628
|
1037/106 / 1080/2116 / 1501/7628 / 1027/
|
Copper Thickness
|
12μm/18μm/35μm/70μm
|
9μm/12μm/18μm/35μm/70μm/105μm
|
Copper Plating Holes
|
20μm(25μm)
|
13μm / 20μm / 25μm
|
Min. Line/ Spacing
|
60μm / 60μm
|
40μm / 40μm
|
Soldermask Registration
|
70μm
|
60μm
|
Min. Soldermask Dam
|
+/-38μmPhoto-imageable)
|
+/- 25μm(Photo-imageable)
|
Soldermask Color
|
Green / White / Black / Red / Blue
|
Green /White / Black / Red / Blue
|
Max. PCB Size
|
575mm × 500mm
|
575mm × 500mm
|
Production Panel
|
609.6mm × 530mm
|
609.6mm × 530mm
|
Min. Annular Ring
|
125μm
|
100μm
|
Smallest Drill
|
0.28mm
|
0.15mm
|
Smallest Routing Bit
|
0.8mm
|
0.8mm
|
Surfaces
|
OSP/Immersion Tin
|
OSP/Immersion Tin
|
Immersion NI/AU
|
Immersion NI/AU
|
|
Plated Ni/AU
|
Plated Ni/AU
|
|
immersion AG
|
immersion AG
|
|
Scoring
|
Yes
|
Yes
|
ID Print
|
White
|
White
|