Silicon Handle Substrate for Bonded Wafer 2" 4" 6" 8" at Western Minmetals (SC) Corporation

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Home > Product > Silicon Handle Substrate for Bonded Wafer 2" 4" 6" 8" at Western Minmetals (SC) Corporation
Product
Silicon Handle Substrate for Bonded Wafer 2" 4" 6" 8" at Western Minme...
Posting date : Dec 27, 2017
Membership
Free Member Scince Dec 26, 2017
FOB Price
1-100USD/pc
Min. Order Quantity
500pcs
Supply Abillity
10000-15000pcs/month
Port
China
Payment Terms
TT in advance
Package
in foam box or cassette, carton box outside
Keyword :
Category
Contact
Tony Fu
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Product Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
WMC
HS-CODE
3818-00
Package & Delivery Lead Time
Package
in foam box or cassette, carton box outside
Detailed Description
Silicon Handle Substrate for Bonded Wafer 2" 4" 6" 8" at Western Minmetals (SC) Corporation
Diameter: 2" 4" 6" 8"
Growth Method: CZ
Conductivity: P type
Crystal Orientation: <100> +/-0.5 or 1.0degree
Resistivity: 0.0015 Ohm.cm max
RRV: 8%, 10% max
Thickness: 425+/-25um, 625+/-25um, or as required
Primary Flat and Length: <100> 16+/-1mm, 32+/-2mm or SEMI
Secondary Flat and Length: 18+/-2mm or SEMI
TTV: 10um max, TIR: 10um max, Bow: 15um max, Warp: 20um max
Front/Backside Finish: Lapped/Etched/Polished
Packing: in foam box or cassette, carton box outside

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