Solderability Testing Device KH23

본문 바로가기


Home > Product > Solderability Testing Device KH23
Product
Solderability Testing Device KH23
Posting date : Mar 28, 2019
Membership
Free Member Scince May 31, 2017
FOB Price
-
Min. Order Quantity
1 set
Supply Abillity
200 Set Per Year
Port
Shenzhen
Payment Terms
L/C, T/T, D/P, Western Union, Paypal
Package
Wooden Carton
Keyword :
Category
Contact
Anna Peng
          0 likes     
Product Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
Zhengye Laser
HS-CODE
9703-00
Package & Delivery Lead Time
Package
Wooden Carton
Delivery Lead Time
30 days
Detailed Description
Usage
This machine is used to test solderability and heat stress for PCB.
Features
1.Internal container is made by special material that conforms to the lead-free standards.
2.Patented design that adopts PID temperature adjustment unit to create stable,uniform and precise temperatures.
3.Time adjustment and alarm functions
4.Conform to flexible PCB technical manual: GB/T 4677-2002;IPC-TM-650 2.4.12-1996;IPC-TM-650 2.4.13-1998.
Parameters
Item  
SPECIFICATION
Model
KH23
Internal dimension
190×250×80(L×W×H)
Shape diameter
450×380×320(L×W×H)
Control box dimension
300×170×150(L×W×H)
Volume of soldering tin
1.90~2.53L (Weight about 13.4~18.0kg)
Temperature adjustment range
Room temperature ~300℃
More information please view here

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
About Us Privacy Policy Terms of use Copyright © 2000-2024 ECROBOT.COM. All rights reserved.
Top