Wave Soldering Machine Technical Parameters (long-lead operation)
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Model
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XH-LF300H1 (Automatic high peak furnace)
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XH-LF300H2(Automatic dip tin furnace)
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Control
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Touch-screen Intelligent Control
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PCB board size
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Max.300mm
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AM device
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Two Groups of Precision Leading Screw Amplitude Modulation,Manual Control
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Transmission speed
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Max.3000mm/min
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Standard capacity
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1500mm/min Standard speed running production
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1500mm/min equivalent orbital speed, uninterrupted run off welding production
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Pre-heating Zone
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Length:1200mm (600*2independently control temperature),Temperature:Ambient230℃
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Pre-heating Method
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Double-section,Infrared Pre-heating (with high-temperature glass) (optional)
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Metal structure,No visible window insulation cover
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Pre-heating Cover
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ambient temperature ~350℃
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Furnace nozzle
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Nozzle effective width 300mm (fixed)
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Nozzle effective width: 150 ~ 300mm(manually adjustable)
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PCB board transfer direction
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From left to right & from right to left
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PCB Conveyor height
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750±20mm
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PCB board solder angle
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0~1°
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Rosin spray pressure /flow
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5~6Kgf/c㎡ 10~100ml/min
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Rosin capacity
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Approx.20 Liters
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Nozzle moves
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Stepping motor,seal,straight-line sliding rail style
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Air Knife
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NO
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NO
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Tin furnace capacity
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300~350Kg
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220~260Kg
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Dross oxide content
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8~10Kg/8Hr(Estimated)
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0.5~1Kg/20Hr(Estimated)
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Furnace frame
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Move up and down or into and out by simple manual screw rod
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Pneumatic plate cam lift,move into and out by manual
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Cooling Mode
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Cooling by natural air on axial fan board
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Apply solder type
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Lead-free solder/ Normal solder
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Lead-free solder/ Normal solder
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Normal / starting power
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Approx.5KW/18KW
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Approx.4.5KW/16KW
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Power supply
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Three-phase Five-wire System 380V 50/60Hz
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Dimensions
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L3300*W1200*H1480
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L3500*W1200*H1480
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Weight
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1300Kg
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1400Kg
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