SSTS-P3/05H1 protect solder paste
Product Description:
Good roll Printing & Screening
More long time continuous printing; NO Caving in 3 hours after printing. SMD not easy for move under it.
Good in weld, and good wettability in all seat.
Good in weld in widly temp reflow soldering.
Less residual,Transparent appearance,That won't erode PCB,can meet NO-CLEAN request.
Good ICT test ability, no wrong discriminant.
Meet PCB special metal welding, no sharp aroma.
Metal Specification |
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Content(%) |
Sn: 96.5/Ag:3.0/Cu:0.5 |
Melt Temp |
217℃ |
Powder Size |
25-45μm (-325/+500) |
Powder shape |
>95 Round |
Liveness type |
RMA |
Copper Mirror Corrosion |
Eligible |
Flux Paster Specification |
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Flux Content(%) |
10±0.5% |
Viscosity Test |
170-210 pa.s |
Collapse performance |
<0.4mm |
Tin sweats Test |
Eligible (under: IPC TM-6502.4.43) |
Residue content |
5.00% |
Rate of Spread |
≥90% |
Packing:
OTHER DETAIL, VICIT OUR WEBSITE OR CONTACT US TO CHECK THE MSDS .