TG150 4 Layer Immersion Tin Pcb Board In Ink Plugging Hole With 2 Prepregs

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 TG150 4 layer Immersion Tin pcb board in Ink plugging hole with 2 Prepregs Ink plugging hole is surface mount technology production requirements of printed circuit board with a special process. It uses screen printing method by plugging ink-sided and multilayer printed circuit board vias become blind through holes, the production technology is the solder stencil printing ink is printed through the drain into the pores, and then the use of capillary suction fill the hole so that the role of the structure of the ink column, completely blocked vias. Immersion tin process is for the benefit of SMT chip package with specially designed surface of the copper chemically deposited tin metal coating, to replace a green new technology Pb-Sn alloy coating manufacturing process, and has been widely used electronic products ( such as circuit boards, electronic devices) and hardware, accessories, and other surface treatment. Immersion tin process characteristics1.Bake at 155 ℃ 4 hours (which is equivalent to storing a year), or by eight days of high temperature and humidity test (45 ℃, relative humidity 93%), still has excellent solderability after reflow or thrice sex;2. immersion tin layer is smooth, flat, dense, difficult to form than the tin plating copper-tin intermetallic compounds, tin whisker;3. Immersion tin layer thickness of up to 0.8-1.5μm, lead-free solder can withstand repeated shocks;4. The solution is stable, the process is simple, and can be supplemented by analysis of continuous use without replacing the cylinder;5. The process is also suitable both for vertical for horizontal processes;6. Immersion tin cost far less than ENIG, HASL and fairly;7. For HAL easily short-circuited HDF has a clear technological advantage, suitable for high-density IC packaging thin rigid board and flexible board;8. suitable for surface mount (SMT) or laminated (Press-fit) installation process;9. Lead-free fluorine-free, pollution-free environment, free recycling waste. Model Number:XCEPCB0017    Shipping port:ShenZhen/HongKong          Place of origin:GuangDong,China    Delivery Time:3-10 Working Days  Production capacity:FR4:2000000Sqms   High Frequency board:10000SqmsPrice Terms:FOBMinimum Order Quantity:1pcPayment terms:TT,Paypal,Western UnionCertification:CE,ROHS,FCC,ISO9008,SGS,UL  Material:FR4Soldermask:GreenMolde Number:xcepcb0017Silkscreen:WhiteLayer:4Panel Size:85*85mmBoard Thickness:1.6mmPackage Details:Inner:Vacuum-packed     Bubble bag     With Foam Outer:Carton BoxMin Line Space:4MilMin Line Width:4MilMin Hole Size:10MilFinished Surface:Immersion TinSpecial requirement:Immersion TinInk plugging hole Provide Slice reportFinished Copper:1ozDelivery Time：6 DaysTypical ApplicationsCellular Base Station Antennas and Power AmplifiersMicrowave point to point (P2P) linksAutomotive Radar and Sensorslow dielectric lossBallast, lights, navigationThe stability of the dielectric constantAn extremely low water imbibitionIT industry,Keyboard products Parameter:oItemData1Layer:1 to 24 layers2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers3Board thickness:0.20mm to 3.4mm4Copper thickness:0.5 OZ to 4 OZ5Copper thickness in hole:>25.0 um (>1mil)6Max. Board Size: (580mm×1200mm)7Min. Drilled Hole Size:4mil(0.1mm)8Min. Line Width:3mil (0.075mm)9Min. Line Spacing:3mil (0.075mm)10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold platingCNC FunctionsScoring Edge to Edge Plated Counter boresSkip Scoring – .250" Spacing Milling30 or 60 Degree Score Angle Blind andBuried Vias30 to 100 Degree Countersink Controlled Z Axis Route15 to 45 Degree Gold Finger Bevel Castellated BarrelsCounterbores Offset or Recessed BevelingPlated CountersinksOther PCB ServicesBlind and Buried ViasPlated Slots Specified DielectricTented Vias Controlled ImpedanceSolder mask Plugged Vias Via Caps (Solder Mask)Conductive Filled ViasQuality / TestingInspect to IPC Class III Continuity Resistance – 10 to 20 OhmsNet List Test per IPC-356D Isolation Resistance – 2 to 30 MegaohmsTest Voltage – 100 to 250 Volts MinimumSMT Pitch 0.5 mmTolerancesPTH Hole Size – +/- .002"Front to Back – +/- .002"NPTH Hole Size – +/- .001"Solder Mask – +/- .002"Tooling Holes – +/- .001"Hole to Pad – +/- .005"Competitive Advantage:1) With UL,ROHS,ISO,IPC2).Lead time:3-10 working days3)Competitive price best quality4).Rich 20 years experience in High Tg Multilayer PCB .   What Information customer need to provide for quotation ?1. PCB Gerber files ,protel,powerpcb,Autocad,etc.2. BOM list for PCB assembly.3. Send us your sample PCB or PCBA.4. OEM is acceptable. Contact Information:Karen-Sales DepartmentShenZhen Xinchenger Electronic Co.,LtdEmail:sales4@xcepcb.comTel:0755-26055813Fax:0755-26055946Skype:karen-xcepcb  url:http://www.xce-pcb.com

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XINCHENGER ELECTRONICS(HK) CO.,LTD

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