110V popular in the world ! laser positioning touch screen BGA rework station WDS-550 for laptop motherboards repair 

Detail Parameter of WDS-550 low cost bga machine :

Main features of WDS-550 low cost bga machine :

1.Perfect support Soldering, Desoldering, Removing and Mounting the BGA Chip

2.Touch screen and PLC controlling to ensure it work stably and reliably.

3.Components mounting accuracy within 0.01mm , Repair success rate 99%

4.Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc

5.Precise Temperature Control, accuracy within 2℃

6.Three temperature zones to heat up independently.

7.Upper temperature zone can be moved freely, Second zone can be adjusted up and down.

8. Hot air nozzle can be rotated in 360 degree

9.With CE certification, double over temperature protection function

Full Specification of WDS-550 low cost bga machine :

1.Adopts mechatronics design,Z axis adopts step driver,the upper heater can move up and down automatically; the upper heater and placement head are designed 2 in 1,can pick up BGA automatically; with laser position,can locate the chips place fast.easy to use.

2.Equipped with touch panel interface and PLC controlling to ensure it work stably and reliably. And it can storage multiple temperature profiling data of users. With password protection and modification function while power on. The temperature profiles will be displayed on the touch screen.3.Three temperature zones to heat up independently, hot air heat up between up and down zones, IR heat in the bottom, temperature precise control is in±2℃.the up heating head can remove the BGA chips automatically;the second zone can be adjusted up and down. The top and bottom heaters can be set several segments control at the same time. IR heating zone can be adjusted output power in the light of operation requirements.4.The hot air nozzle can be rotated in 360 degree, the IR heater in the bottom can heat up the PCB board uniformly. 

5.High accuracy K-type thermocouple closed-loop controlling. It can test temperature accurately through external temperature measurement interface, PCB board positioned by closed V-shape slot. The flexible and convenient universal jigs can prevent any damage or PCB deformation as well as it is suitable for all size of BGA package.6.Large power fan to cool down the PCB quickly. The built-in vacuum pump and external vacuum nozzle is able to take BGA chips out automatically.

7.Having alarm prompt function after welding is done, specially added early warning function for convenient operation.8.It has Passed CE certificate. It is equipped with emergency stop switch and protection equipment to power off automatically when abnormal accident happened. Under this situation that temperature is out of control, circuit can automatically cut off the power with double over temperature protection function.

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