Addition cure encapsulating and potting compound

본문 바로가기


Home > Product > Addition cure encapsulating and potting compound
Product
Addition cure encapsulating and potting compound
Posting date : Aug 07, 2015
Membership
Free Member Scince Aug 07, 2015
FOB Price
USD 10-15/KG
Min. Order Quantity
200 KGS
Supply Abillity
600 TON PER MONTH
Port
shenzhen
Payment Terms
T/T,L/C
Package
1KG,5KGS,20KGS,25KGS,200KGS
Keyword :
Category
Contact
Abbie
          0 likes     
Product Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
HongYe silicone
Model Number
HY 9055
HS-CODE
3910-
Package & Delivery Lead Time
Package
1KG,5KGS,20KGS,25KGS,200KGS
Delivery Lead Time
5-15days
Detailed Description
Addition cure encapsulating and potting compound
 
1.Product Feature of Electronic Potting Silicone Rubber
HY 9055 silicone rubber is a kind of low viscosity, Inherent flame resistance, two components addition cured potting silicone with heat conducting. It cures with both on room temperature and heated temperature. It has the feature of the higer temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of  PC,PP,ABS,PVC, etc. and metal materials.
 
2.Typical Application of Electronic Potting Silicone Rubber
 
 
HY 9055 electronic potting silicone rubber could be applied to
- high powered electronics,  
- DC or DC module and circuit board which requires heat dissipation and high temperature resistance.
-It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc. 
 
Technical Parameters of of Electronic Potting Silicone Rubber
Features
Part A
Part B
Before Curing
Appearence
Gray Fluid
White Fluid
Viscosisty(25 centigrade cps)
2500±500
2500±500
Operation features
Mixing Ratio
1:1
Viscosisty(after mixing) (cps)
2000~3000
Operating Time(25 centigrade  hr)
120
Curing time (25 centigrade,min)
480
Curing time(80 centigrade  hr)
20
 
 
After Curing
Hardness(Shore  A)
55±5
Thermal conductivity [W(m·K)]
>=0.8
Dielectric Strength(KV/mm)
≥25
Permittivity(1.2MHz)
3.0~3.3
Volume Resisivity(Ω·cm)
≥1.0×1016
linear expansibility [m/(m·K)]
≤2.2×10-4
Fire Resistance   
94-V1
(Pls note: the above data for this product in 25 ℃ temperature, 55 percent humidity conditions, for reference. The accurate data is measured by customers when using.)
 
If you need more information,pls contact Abbie:
Tel:86-755-89311348
Fax:86-755-89948030A
Mob:86-18938867560
Mail:hyab at resinpu dot com
Facebook:HYJCY at SZRL dot net 
YouTube:silicone0041 at gmail dot com

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
About Us Privacy Policy Terms of use Copyright © 2000-2024 ECROBOT.COM. All rights reserved.
Top