Condensation encapsulating and potting compound

본문 바로가기


Home > Product > Condensation encapsulating and potting compound
Product
Condensation encapsulating and potting compound
Posting date : Aug 07, 2015
Membership
Free Member Scince Aug 07, 2015
FOB Price
USD 6-12/kg
Min. Order Quantity
200 KGS
Supply Abillity
600 TON PER MONTH
Port
shenzhen
Payment Terms
T/T,L/C
Package
1KG,5KGS,20KGS,25KGS,200KGS
Keyword :
Category
Contact
Abbie
          0 likes     
Product Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
HongYe silicone
Model Number
HY215
HS-CODE
3910-
Package & Delivery Lead Time
Package
1KG,5KGS,20KGS,25KGS,200KGS
Delivery Lead Time
5-15days
Detailed Description
Condensation encapsulating and potting compound
HY210 and HY215 are condensation silicone compound in two parts with the characteristics of low viscosity,easy pouring operation and good bonding feature.it can be cured completely at room temperature.the safety potting compound silicone can reach the EU ROHS requirement fully.
 
Application:
Applying for the surface of PC,PP,ABS,PVC,metal,etc
Potting for protection of general electronic module
Insulation,waterproof and bonding of electronics parts
Filling for LED,LCD electronic display,circuit board
Outdoor protection for LED screen 
Technical Parameters for PCB Electronic Potting Silicone
Properties index
Part A
Part B
Before Curing
Appearence
Black fluid
Colorless / yellowish fluid
Viscosisty (cps)
2500±500
-
Features when operation
Mixing Ratio ( By weight)
10:1
Operating Time (25 centigrade min)
20~30
Curing time ( hr, basically cured)
3
Curing time ( hr, perfectly cured)
24
Hardness(shore A)
15+/-3
 
After Curing
Thermal Conductivity[W( m·K)]
.=0.4
Dielectric Strength( kV/mm)
≥25
Dielectric permittivity(1.2MHz)
3.0~3.3
Volume resistivity(Ω·cm)
≥1.0×1016
Fire Resistance
94-V1
(Pls note all data of  PCB Electronic Potting Silicone Rubber with black color above is in 25C with 55% humidity conditions. We don't guarantee a same date if testing under different conditions, or when data was regenerated).
Technical Guidelines
1. Pls put part A and B in separate container and stir evenly before mixing the two   parts together.2. Mixing Ratio part A:part B is 10:13. Bubble release if necessary, deaeration the mixture under 0.08 MPa for 3 minutes.4. HY-215 is cured at roon temperature, so pls put it under room temperature after   pouring. It comes to next process when basically cured, and it takes about 24 hours   for completely cured.
If you need more information,pls contact Abbie:
Tel:86-755-89311348
Fax:86-755-89948030
Mob:86-18938867560
Mail:hyab at resinpu dot com
Facebook:HYJCY at SZRL dot net 
YouTube:silicone0041 at gmail dot com
QQ:2355542681
 

ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us
Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea
About Us Privacy Policy Terms of use Copyright © 2000-2024 ECROBOT.COM. All rights reserved.
Top