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Products 7,579 Result
High Demand Mould Steel Material , Pre Hardened Tool Steel P20+Ni / 71...
Mar 07 2018
1.2738/P20+Ni/718 Plastic Mold Steel Plate For Making High Demand Large Plastic Mold Equivalent grades: - - - - GB | DIN | AISI | ASSAB | 3Cr2NiMnMo | 1.2738 | P20+Ni | 7…
HS-CODE : 85-
Guangzhou Changfeng Stee...
China [CN]
Scince 2012
Free Member
WOODEN AND GLASS MATERIAL JEWELRY STORE DISPLAY FURNITURE
Mar 07 2018
Model number : KDJ-055 Size : Customized Material : MDF, flame retardant plywood,wood, lacquer,stainless steel ,temper glass,acrylic,metals,Laminates. Light : LED strip Color : Customized…
HS-CODE : 44-
Guangzhou Kong-da Indust...
China [CN]
Scince 2003
Free Member
High Effective Wire Bending EquipmentFor 2 - 5mm High Carbon Steel Mat...
Mar 06 2018
High-carbon Steel 2-5mm Computerized Wire Bending Machine with Ten Axes - - - - HYD-80-10A Wire Foming Machine Technical Parameters | Model | HYD-80-10A | Axis Count | 10 Axes | …
HS-CODE : 85-
Dongguan Hua Yi Da Sprin...
China [CN]
Scince 2000
Free Member
2L Resin Plug Vias Board Board Thickness:1.6mm; Material:FR4;Surface...
Mar 05 2018
2L Resin Plug Vias Board  Board Thickness:1.6mm;  Material:FR4;Surface Finishing:HASL LF 
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
8L Blind Vias Board; Board Thickness:1.0mm ; Materail:FR4 TG170; Surfa...
Mar 05 2018
8L Blind Vias Board; Board Thickness:1.0mm ; Materail:FR4 TG170; Surface Finishing: Flash Gold +Hard Gold (Au 15U')
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
GM Automobile Board Layers:2L; Board Thickness:2.0mm ; Material:FR4; S...
Mar 05 2018
GM Automobile Board Layers:2L; Board Thickness:2.0mm ; Material:FR4; Surface Finishing:HAL
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
Ford Automobile Board Layers:2L; Board Thickness:1.6mm ; Material:FR4;...
Mar 05 2018
Ford Automobile Board Layers:2L; Board Thickness:1.6mm ; Material:FR4; Surface Finishing:HAL
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
HP Printer Bonding board Layers:2; Board Thickness:1.6mm ; Material:FR...
Mar 05 2018
HP Printer Bonding board Layers:2; Board Thickness:1.6mm ; Material:FR4;Surface Finishing:Immersion Gold 4U'
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
HP Printer board Layers:4 ; Board Thickness:1.0mm;Surface Finishing:I...
Mar 05 2018
HP Printer board Layers:4 ;  Board Thickness:1.0mm;Surface Finishing:Immersion Gold 6U'
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
Camera Board Layers: 4 ; Board Thickness: 1.6mm ; Base Material:FR4;S...
Mar 05 2018
Camera Board  Layers: 4 ; Board Thickness: 1.6mm ; Base Material:FR4;Surface Finishing:Immersion Gold 4U'
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
Simens Board Layers:8 ;Board Thickness:1.8mm ; Material:FR4 ; Surface...
Mar 05 2018
Simens Board Layers:8 ;Board Thickness:1.8mm ;  Material:FR4 ; Surface Finishing:Immersion Gold
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
Layers:6 ;Board Thickness:1.6mm ; Material:FR4 ; Surface Finishing:HAL...
Mar 05 2018
Layers:6 ;Board Thickness:1.6mm ; Material:FR4 ; Surface Finishing:HAL min trace w-s: 3-3mil
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
Layers:8 ; Board Thickness:1.6mm ; Material:FR4; Surface Finishing:imm...
Mar 05 2018
Layers:8 ; Board Thickness:1.6mm ; Material:FR4; Surface Finishing:immersion gold
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
Philips Layers:1L;Board Thickness:1.6mm; Material:Aluminum; Surface F...
Mar 05 2018
Philips  Layers:1L;Board Thickness:1.6mm; Material:Aluminum; Surface Finishing:Immersion Ag
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member
Back light source Layers:1L; Board Thickness:0.9mm; Material:Aluminum...
Mar 05 2018
Back light source  Layers:1L; Board Thickness:0.9mm; Material:Aluminum ; Surface Finishing: HASL LF
HS-CODE : 8534-00
Sunking Circuits PCB
China [CN]
Scince 2009
Free Member

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