Features of Coextruded Packaging Materials:
1. Coextruded stretching film
basic structure: PE/TIE/PA/EVOH/PA/TIE/PE
This coextruded film is suitable for various cooked meats or soybean foods that …
Insulation Pipe is a flexible thermal insulation. It is of very lower thermal conductivity and high water vapor diffusion resistance due to its closed cell structure and used to retard heat gain and p…
Insulation Pipe is a flexible thermal insulation. It is of very lower thermal conductivity and high water vapor diffusion resistance due to its closed cell structure and used to retard heat gain and p…
Insulation Pipe is a flexible thermal insulation. It is of very lower thermal conductivity and high water vapor diffusion resistance due to its closed cell structure and used to retard heat gain and p…
Insulation Pipe is a flexible thermal insulation. It is of very lower thermal conductivity and high water vapor diffusion resistance due to its closed cell structure and used to retard heat gain and p…
Insulation Pipe is a flexible thermal insulation. It is of very lower thermal conductivity and high water vapor diffusion resistance due to its closed cell structure and used to retard heat gain and p…
Insulation Pipe is a flexible thermal insulation. It is of very lower thermal conductivity and high water vapor diffusion resistance due to its closed cell structure and used to retard heat gain and p…
Insulation Pipe is a flexible thermal insulation. It is of very lower thermal conductivity and high water vapor diffusion resistance due to its closed cell structure and used to retard heat gain and p…
Insulation Pipe is a flexible thermal insulation. It is of very lower thermal conductivity and high water vapor diffusion resistance due to its closed cell structure and used to retard heat gain and p…
Insulation Pipe is a flexible thermal insulation. It is of very lower thermal conductivity and high water vapor diffusion resistance due to its closed cell structure and used to retard heat gain and p…
Insulation Pipe is a flexible thermal insulation. It is of very lower thermal conductivity and high water vapor diffusion resistance due to its closed cell structure and used to retard heat gain and p…
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ECROBOT CO., Ltd, Business Registration Number : 220-88-71747, CEO J.W.Park, TEL : +82-2-552-7676, E-mail : E-mail : Contact us Address : (Hwanghwa B/D 11F, Yeoksam-dong)320, Gangnam-daero, Gangnam-gu, Seoul, South Korea