Aluminum copper clad laminate

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Selling leads
Aluminum copper clad laminate
Posting date : Oct 30, 2014
Membership
Free Member Scince Nov 29, 2013
FOB Price
28
Min. Order Quantity
1
Supply Abillity
50000 SHEETS PER MONTH
Port
SHANGHAI
Payment Terms
TT / LC
Package
WOODEN PALLET
Keyword :
Category
Contact
Cynthia
Selling Leads Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
LESON
Model Number
CCL
HS-CODE
7410-21
Package & Delivery Lead Time
Package
WOODEN PALLET
Delivery Lead Time
5-18 DAYS
Specifications
Type of Certification
UL
Reference no.
E315523
Name.
UL
Issued By
UL LAB
Start Date (validity period)
0000-00-00
End Date (validity period)
0000-00-00
Scope
INSULATION MATERIAL
Image

Detailed Description
Aluminum copper clad laminate 
Product DescriptionAL base thermal conductive CCL provides the advantages of high thermal conductivity, Excellent solder heat endurance, Excellent Breakdown Voltage, reliability, Thermal conductivity is about five-ten times higher than the FR-4, PCB produced by the subtract can transfer heat, which is electronic components generate, throughing the substrate structure rapid conduct to the back-end cooling base or other cooling modules. Aluminum Copper Clad Laminate Sheet is a sandwich structure, which includes layers of conductor, insulator and metal base. In general, this insulator is made of epoxy resin and high thermal Conductivity filler. The products have been through a number of demanding for a long time environmental testing, access to international certification. The Thermal conductivity is 1.0-3.0W/M. K, It can fit the demand of high end and MID-range products, with high cost performance. All products pass RoHS standard, have good property and meet low-carbon environmental trend.
 
 Product Feature
1. Excellent thermal conductivity
2. Excellent Breakdown Voltage
3. RoHS compliance
4. Excellent solder heat endurance
5. Excellent mechanical properties
6. Excellent electromagnet
7. Can use external cooling device directly
8. High cost performance
 
Product Specification/Models
Type 1 General purpose. It is widely used in consumer lighting, outdoor LED display and backlight applications
Type 2 Standard thermal conductivity It is used in public lighting, digital, PC, Audio, Automotive applications
Type 3 High thermal conductivity. It is used in high power LED lighting, automotive applications, Industrial electronics
Type 4 High thermal conductivity, Low thermal resistance; It is used in high power applicationApplicationLED lighting, public lighting, Backlight module, outdoor LED display, Industrial electronics
 
Material Sandwich   structure, which includes layers of conductor, insulator and metal base (Aluminum Based).
Standard Size (mm) 5 00×600mm,510×610mm,1000×1220mm,1100×1220mm
Circuit Layer(copper foil ) 18μm , 35μm,70μm,105μm ( Hoz,1oz,2oz, 3oz )
Thermal Dielectric Layer Thickness 100μm,120μm,150μm,(3mil,4mil,5mil,6mil)
Thickness 0.8mm ,1.0mm,1.2mm,1.5mm,1.5mm,2.0mm
Aluminum Substrate Type 1100,1060,3003,5052,6061 Anodization
Masking Film PE,PET,PI
Using scope  LED lighting, public lighting, Backlight module, outdoor LED display , Industrial electronics

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