Copper clad laminate FR4

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Selling leads
Copper clad laminate FR4
Posting date : Dec 12, 2014
Membership
Free Member Scince Oct 29, 2014
FOB Price
20 USD PER SHEET
Min. Order Quantity
1
Supply Abillity
50000 SHEETS PER MONTH
Port
SHANGHAI
Payment Terms
TT / LC
Package
WOODEN PALLET
Keyword :
FR4
Category
Contact
Cynthia
Selling Leads Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
LESON
Model Number
INSULATION SHEET
HS-CODE
7410-21
Package & Delivery Lead Time
Package
WOODEN PALLET
Delivery Lead Time
5-18 DAYS
Specifications
Type of Certification
UL
Reference no.
E315523
Name.
UL
Issued By
UL LAB
Start Date (validity period)
0000-00-00
End Date (validity period)
0000-00-00
Scope
INSULATION MATERIAL
Image

Detailed Description

Best Price FR4 Copper Clad Laminate is a kind of copper foil covered laminated board formed through heat pressing after the electric industry alkali-free glass fiber dips into thermoset epoxy resins and is covered with copper foil at one side or both sides. Usually used in PCB with printed circuit on one or both sides of computers, home electric appliances and other lines.

 

FR4 Copper Clad Laminate

1.Material

composite polymer(flame- retardant epoxy resin, E-glass fiber cloth with copper as cladding

2.Technics

Mixing ,Coating,Folding,Laminated,Return Line,Cutting,Packing

3.Color

natural color(light green ),yellow, and black,or as per customer's requirement

4.Measurement

41"X49",43"X49"(1040*1240mm)  

5. Feature:

Lead Free, Flame retardant, thermal reliability, lower warpage,

6.Using scope

Suitable for high-count layer PCB, computer, communication equipment, OA equipment, lead-free PCB process, etc.

7.Packing

carton packaging/ 250 sheet per pallet

8. Certification

ISO9001,ISO14001,CQC,UL

9.Payment

T/T,L/C, Western Union ,USD

10. Technological requirements

For your choices

 

 

   

 

 

 

 

 

 

 

 

 

 

 

 

 Properities  

1.Tg≥130°C(DSC)

2.UV blocking and AOI compatible ,so as to increase productivity efficiency

3.High thermal performance ,Td ≥325°C,T288≥5min,suitable for lead-free process.

4.Good flatness, smooth surface,no pits 

Suitable for high-count layer PCB, computer, communication equipment, OA equipment, 


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