Aluminum based copper clad laminate
China [CN] Aluminum based copper clad laminate
AL base thermal conductive CCL provides the advantages of high thermal conductivity, Excellent solder heat endurance, Excellent Breakdown Voltage, reliability, Thermal conductivity is about five-ten times higher than the FR-4, PCB produced by the subtract can transfer heat, which is electronic components generate, through the substrate structure rapid conduct to the back-end cooling base or other cooling modules. Aluminum Copper Clad Laminate Sheet is a sandwich structure, which includes layers of conductor, insulator and metal base. In general, this insulator is made of epoxy resin and high thermal Conductivity filler. The products have been through a number of demanding for a long time environmental testing, access to international certification.
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Material |
Sandwich structure, which includes layers of conductor, insulator and met High thermal conductive AL base CCL al base (Aluminum Based). |
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Standard Size (mm) |
500×610mm,550×610mm,550×1220mm,550×1220mm,1000×1220mm,1100×1220mm |
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Circuit Layer(copper foil ) |
18μm,35μm,70μm,105μm(Hoz,1oz,2oz, 3oz) |
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Thermal Dielectric Layer Thickness |
75μm,100μm,125μm,150μm,(3mil,4mil,5mil,6mil) |
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Thickness |
0.8mm,1.0mm,1.2mm,1.5mm,1.5mm,2.0mm |
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Aluminum Substrate Type |
1100,1060,3003,5052,6061 Anodization |
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Masking Film |
PE,PET,PI |
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Using scope |
LED lighting, public lighting, Backlight module, outdoor LED display , Industrial electronics |
The Thermal conductivity is 1.0-3.0W/M. K, It can fit the demand of high end and MID-range products, with high cost performance. All products pass ROSH standard, have good property and meet low-carbon environmental trend. Properities 1. Excellent thermal conductivity 2. Excellent Breakdown Voltage 3. ROSH compliance 4. Excellent solder heat endurance 5. Excellent mechanical properties 6. Excellent electromagnet 7. Can use external cooling device directly 8. High cost performance
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