Ylp-10/20/50 Mobile Phone Back Cover Laser Marking Machine

Features

With the technological progress of the microelectronics industry and the continuous improvement of people's pursuit of personalization of mobile phones, the mobile phone industry is moving towards integration and high-precision. Its product components are becoming smaller and more compact, and processing techniques are becoming more and more. complex. As a pioneer in the laser industry, TANDBERG Laser relies on its own technological advantages to organically combine laser application technology with modern mobile phone manufacturing technology, and solve many problems in the current mobile phone industry production, such as mobile phone shell cutting, motherboard manufacturing, Keyboard chip marking and engraving and punching of earpieces, earphones, accessories, etc. It makes up for the shortcomings of traditional craftsmanship and provides more precise and efficient processing solutions for your mobile phone manufacturing and processing. At the same time, advanced laser application technology provides you with a complete laser application process, which not only meets your diversified processing needs, but also brings you more considerable economic benefits for processing and production.

Scope of application

It is used in welding occasions with high welding process requirements and convenient light path movement. It can weld fine microelectronic components, integrated circuit leads and other precision parts. 3C industry welding, mobile phone circuit board QR code marking, mobile phone shell laser marking.