LED lighting Thermal phase chaging materials Interface Pad Pink Low Resistance 0.95 W/MK

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Product
LED lighting Thermal phase chaging materials Interface Pad Pink Low Re...
Posting date : Dec 08, 2017
Membership
Free Member Scince Nov 16, 2017
FOB Price
negotiation
Port
China
Package
1000pcs/bay
Keyword :
Category
Contact
Dana
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Product Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
Ziitek
Model Number
TIC™810P
HS-CODE
92-
Package & Delivery Lead Time
Package
1000pcs/bay
Delivery Lead Time
3-5days
Detailed Description
Pink Low Resistance Thermal Interface Pad for Computer Serves The TIC810PSeriesislow melting point thermal interface material. At 50, The TIC800PSeries begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. The TIC810PSeriesshows no thermal performance degradation after 1,000hours@130,orafter 500 cycles, from -25 to125.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. Features: > 0.024-in /W thermal resistance > Naturally tacky at room temperature, noadhesive required > No heat sink preheating required Applications: > High Frequency Microprocessors > Notebook and Desktop PCs > Computer Serves > Memory Modules > Cache Chips > IGBTs - - - - Typical Properties ofTIC800P Series | Product Name | TICTM803P | TICTM805P | TICTM808P | TICTM810P | Testing standards | Color | Pink | Pink | Pink | Pink | Visual | Composite Thickness | 0.003" (0.076mm) | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | | Thickness Tolerance | 0.0006" (0.016mm) | 0.0008" (0.019mm) | 0.0008" (0.019mm) | 0.0012" (0.030mm) | | Density | 2.2g/cc | Helium Pycnometer | Work temperature | -25125 | | phase transition temperature | 50~60 | | Setting temperature | 70 for 5 minutes | | Thermal conductivity | 0.95W/mK | ASTM D5470 (modified) | Thermal lmpedance @ 50 psi(345 KPa) | 0.021-in/W | 0.024-in/W | 0.053-in/W | 0.080-in/W | ASTM D5470 (modified) | 0.14-cm/W | 0.15-cm/W | 0.34-cm/W | 0.52-cm/W | - - - - Standard Thicknesses: 0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) Consult the factory alternate thickness. Standard Sizes: 9" x 18"(228mm x 457mm)9" x 400'(228mm x 121M) TIC800 series are supplied with a white release paper and a bottom liner. TIC800 series is available in kiss cut an extended pull tab liner or individual die cut shapes. Peressure Sensitive Adhesive: Peressure Sensitive Adhesive is not applicable for TIC800 series products. Reinforcement: No reinforcement is necessary.

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