AlSi Alloys Microelectronic Package

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Product
AlSi Alloys Microelectronic Package
Posting date : Apr 06, 2016
Membership
Free Member Scince Apr 07, 2015
FOB Price
0-1000
Min. Order Quantity
1
Supply Abillity
5000ton/year
Port
tianjin
Payment Terms
1
Package
cartons
Keyword :
Category
Contact
Ivy zhang
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Product Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
baienwei
HS-CODE
0706-90
Package & Delivery Lead Time
Package
cartons
Detailed Description
Product Description
Computer CPU,DSC chips
Integrated Circuit Package Housings
Carriers
 Radar Microwave modules
Semiconductor Wafers
Electronic Communications Devices
Materials:Silicon Aluminum Alloys(AlSi Alloys)
Configuration:Platforms,Plug-ins,Flatpacks,TO Headers etc.
Advantages
CTE match to circuit boards and components;
High thermal conductivity and outstanding heat dissipation;
Low density;
Hermeticity;
Dimensional stability;
Corrosion Resistance;
Wafer Level Packaging;
Ease of manufacture.
 AlSi Alloys Performance Parameters
 Content
Densityg/cm³
CTEppm/℃
Thermal ConductivityW/mK
Tensile StrengthMPa
Yield StrengthMPa
Poisson's Ratio
Elongation%
  Elastic ModulusGPa
Al-27%Si
2.6
17
175
170
130
0.29
3.8
91
Al-42%Si
2.55
13.5
160
200
187
0.29
1
105
Al-50%Si
2.5
11.5
140
220
210
0.28
<1
108
Al-60%Si
2.46
10
125
210
210
0.27
<1
111
Al-70%Si
2.43
7.5
120
135
135
0.27
<1
114
 

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